• Direct bonding of restorations made of metal, ceramic, zirconia, composite, etc.
• Cementation of orthodontic bands.
• Direct bonding under light-cured composite resin or compomer fillings.
• Repair dental restorations of ceramic, composites or metal alloys, used with light cure composite resin.
• Used with resin cement.
Advantages
• Suitable for various substrates.
• Capable of total-etch, self-etch and selective-etch.
• Works with cement of light-cured, self-cured and dual cured.
• Contains MDP monomer, delivering self-etching properties and higher bonding strength.
• Bonding strength no lower than 20 MPa.
• Low film thickness of 3um.
• Effectively seals over 90% dentin tubules.
• Ultra-mild pH(PH=2.7)provides excellent dentin bond strengths and enamel bonds.
• High moisture tolerance, providing consistently high bond strength on both dry and moist dentin.
